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1 plasma sputtering
плазмове розпилюванняEnglish-Ukrainian dictionary of microelectronics > plasma sputtering
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2 sputtering
розпилювання Процес випуску атомів або групи атомів з поверхні катода (негативного електроду) у вакуумній трубці як результат дії важких іонів. Цей процес використовується для осадження тонкого шару металу на скло, пластик, метал або іншу поверхню у вакуумі - bulk sputtering
- cathode sputtering
- dc sputtering
- diode sputtering
- high-rate sputtering
- ion-beam sputtering
- laser sputtering
- magnetron sputtering
- physical sputtering
- plasma sputtering
- radio-frequency cathode sputtering
- reactive sputtering
- RF sputtering
- secondary sputtering
- thin-film sputtering
- triode sputteringEnglish-Ukrainian dictionary of microelectronics > sputtering
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3 chamber
- CO2/LN2 chamber
- deposition chamber
- environment chamber
- evacuated growth chamber
- evaporation chamber
- high-low chamber
- humidity chamber
- inserting chamber
- internal chamber
- low-vacuum chamber
- plasma-etching chamber
- processing chamber
- reaction chamber
- sealed chamber
- sputtering chamber
- supervacuum chamber
- taking-out chamber
- ultrahigh-vacuum chamber
- work piece chamber
- work chamber -
4 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system
См. также в других словарях:
plasma sputtering — plazminis dulkinimas statusas T sritis radioelektronika atitikmenys: angl. plasma sputtering vok. Plasmazerstäubung, f rus. плазменное распыление, n pranc. pulvérisation à plasma, f … Radioelektronikos terminų žodynas
plasma sputtering — Смотри плазменное распыление … Энциклопедический словарь по металлургии
Sputtering — is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin film deposition, etching and analytical techniques (see below). Physics of sputtering Physical… … Wikipedia
Plasma-unterstütztes Ätzen — (physikalisch chemisches Ätzen) bezeichnet eine Gruppe von subtraktiven (abtragenden) Mikrostrukturverfahren in der Halbleitertechnologie. Als Trockenätzverfahren stellen sie alternative Strukturierungsverfahren zum sog. Nassätzen (nasschemischen … Deutsch Wikipedia
Sputtering — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique … Wikipédia en Français
Plasma-enhanced chemical vapor deposition — PECVD machine at LAAS technological facility in Toulouse, France. Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved… … Wikipedia
Plasma (physics) — For other uses, see Plasma. Plasma lamp, illustrating some of the more complex phenomena of a plasma, including filamentation. The colors are a result of relaxation of electrons in excited states to lower energy states after they have recombined… … Wikipedia
pulvérisation à plasma — plazminis dulkinimas statusas T sritis radioelektronika atitikmenys: angl. plasma sputtering vok. Plasmazerstäubung, f rus. плазменное распыление, n pranc. pulvérisation à plasma, f … Radioelektronikos terminų žodynas
Pulvérisation cathodique (sputtering) — Pulvérisation cathodique La pulvérisation cathodique est une méthode de dépôt de couche mince. Sommaire 1 Principe 1.1 Synthèse de films céramiques 1.2 Instabilité électrique … Wikipédia en Français
Interacción plasma-pared — Este artículo o sección sobre física necesita ser wikificado con un formato acorde a las convenciones de estilo. Por favor, edítalo para que las cumpla. Mientras tanto, no elimines este aviso puesto el 15 de diciembre de 2007. También puedes… … Wikipedia Español
High Power Impulse Magnetron Sputtering — (HIPIMS, also known as High Impact Power Magnetron Sputtering and High Power Pulsed Magnetron Sputtering, HPPMS) is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely… … Wikipedia